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AI Demand Fuels Competition in Semiconductor Chip Packaging

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Growth in artificial intelligence is driving expansion across the semiconductor industry. Chip packaging, the stage where processors are assembled and connected, is becoming increasingly competitive as a result. Taiwan's TSMC, the world's largest contract chipmaker, currently holds a dominant position in the most advanced packaging techniques. Among these is chip-on-wafer-on-substrate, known as CoWoS, which is widely used for high-performance chips. The rising competition reflects how AI's needs are reshaping the market for packaging technology.

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AI Demand Fuels Competition in Semiconductor Chip Packaging · ShortSingh